COB Package · Ultra-HD Fine Pitch · Indoor
COB Package · Ultra-HD Fine Pitch · Indoor
COB CV-PRO Series features advanced Chip-on-Board LED packaging with ultra-fine pixel pitch down to P0.9375mm. Common anode design delivers superior efficiency. Ideal for high-end conference rooms, command centers, home theaters, and exhibition halls. No-backshell ultra-light design enables seamless splicing.
Inquiry / 询价| Pixel Pitch | P0.9375 / P1.25 / P1.5625 / P1.875 (common anode) |
|---|---|
| Pixel Structure | COB 1R1G1B (Real & Virtual Pixel) |
| Pixel Density | 1,137,778 / 640,000 / 490,600 / 284,444 dots/㎡ |
| Module Size (W×H) | 150×337.5mm |
| Backshell | No Backshell (Ultra-thin & Light) |
| Scanning Method | 1/60 ~ 1/40 |
| Refresh Rate | ≥3840Hz |
| Brightness | 500-600 cd/㎡ |
| Supply Voltage | DC 4.2V |
| Driver IC | Constant Current Drive |
Ultra-HD COB with pixel density up to 1,137,778 dots/㎡ — perfect for close-range 4K/8K display in premium conference and command center environments.
Chip-on-Board encapsulation protects LEDs from moisture, dust, ESD, and physical impact. Significantly lower dead pixel rate than traditional SMD at fine pitch.
No-backshell ultra-thin design with common anode technology. Supports front maintenance, dual system backup, and versatile installation methods.
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